University of Wisconsin-Madison Wisconsin Center for Applied Microelectronics College of Engineering University of Wisconsin-Madison Wisconsin Center for Applied Microelectronics
WCAM Home
Material Safety Data Sheets (MSDS)

    For your convenience, this page provides links to Material Safety Data Sheets (MSDS) for some of the chemicals and materials which may be in use in the WCAM labs. This is not a complete listing of chemicals in the labs. A complete set of hard copies of relevant MSDS can be found at the users' computer station in the gowning room.





NUMERIC

1165 Remover



A

Acetic acid CH3COOH

Acetone (CH3)2CO

Ammonium fluoride NH4F

Ammonium hydroxide NH3(aq)

Argon Ar compressed gas

AZ 300 MIF developer

AZ 327 & 440 developers

AZ 400T stripper

AZ nLOF 2070 photoresist

AZ 5414E photoresist



B

Buffered oxide etch BOE 6:1 and 15:1



C

Cadmium selenide CdSe

Cadmium sulfide CdS

Cadmium telluride CdTe

Carbon C

Crystalbond 590 mounting wax



D

Dichloromethane AKA Methylene chloride



H

Hydrofluoric acid


I

Indium phosphide (InP)

Indium/gallium phosphide (InGaP) nanocrystals in water

Isopropyl alcohol



L

Lead telluride PbTe

Lithium niobate LiNbO3



M

MF-26A (developer)

Methyl isobutyl ketone (MIBK)



P

Parylene C dimer

Polyimide film (3M 5413 Kapton tape)

Potassium hydroxide (KOH)



S

S 1813 photoresist

SC 1827 photoresist

SU8 developer

Sulfuric acid



T

Tetramethyl ammoniuim hydroxide (TMAH)

Titanium (Ti)






Contact WCAM staff with additional questions.




Date last modified: 08-Jun-2011 11:16:43  · Date created: 08-Jun-2011
Content by: WCAM staff  ·  Accessibility  ·  Web services

Most browsers can open the PDF files on this page. If you need a free PDF viewer, please visit the Adobe Reader website.
To listen to the file, use View > Read Out Loud in Acrobat Reader.

Copyright 2010 The Board of Regents of the University of Wisconsin System