University of Wisconsin-Madison Wisconsin Center for Applied Microelectronics College of Engineering University of Wisconsin-Madison Wisconsin Center for Applied Microelectronics
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Cost Recovery Rates Effective 1 June 2014:

Internal Rates (UW-Madison users)

Access Cleanroom Hourly Rate Basic Equipment Special Equipment Exceptional Equipment Custom Processing by Staff User Training by Staff Fee Cap Per User *
$41/month + $200 one-time startup fee per user $38/hour $0.00/hour $32/hour $47/hour $62/hour NO CHARGE $670/month


*The Cap amount is the maximum a user will be billed per month, subject to the following: The cap includes all Hourly and Equipment ratews, but excludes the Monthly Access fee and any Staff Processing fees.

Academic Institution Rates (Academic users other than UW-Madison)

Access Cleanroom Hourly Rate Basic Equipment Special Equipment Exceptional Equipment Custom Processing by Staff User Training by Staff Fee Cap per User
$41/month + $272 one-time startup fee per user $57/hour $0.00/hour $49/hour $70/hour $90/hour NO CHARGE NO CAP

External Rates (Non-academic users)

Access Cleanroom Hourly Rate Basic Equipment Special Equipment Exceptional Equipment Custom Processing by Staff User Training by Staff Fee Cap per User
$52/month + $500 one-time startup fee per user $95/hour $0.00/hour $80/hour $118/hour $185/hour NO CHARGE NO CAP


A "User" is a single person; multiple persons cannot be one user.


Material Charges

Gold: $83/gram

Equipment Recharge Rate Categories

Basic Equipment (no additional charge) Special Equipment Exceptional Equipment
PLASMA PROCESSING:
    Samco UV/ozone stripper
    YES Plasma Asher

LITHOGRAPHY:
    HMDS vapor prime system
    Photoresis spin coaters
    Non-litho spin coater
    UV contact aligners & exposure tools
    Develop stations and developers
    Bake stations

WET BENCHES (INCLUDING CHEMICALS):
     HF/BOE
     Piranha
     Metal Etchants
     Nitride Etch
     III - V Materials Wet Bench
     Pre-furnace clean (Piranha; RCA; HF)
     KOH/TMAH Silicon Etch
     SU-8 Processing Bench
     PR stripper / mask cleaner bench
     Liftoff Solvent Bench

PACKAGING:
    Dicing saws
     Wire Bonders (Au & Al)
     MEI Die Attacher
     Package annealer
     Programmable polyimide oven
     Polymer oven

ANALYSIS:
    Microscopes & digital cameras
    Film thickness measurement
    Step height measurement
    Film stress measurement
    4pt probe
    I-V Probe station

THERMAL PROCESSING:
     Rapid thermal annealer

MEMS PROCESSING:
     Tousimis Critical Point Dryer

         PLASMA ETCH:
    PlasmaTherm 70 RIE/PECVD
    Unaxis 790 RIE
    Unaxis 790 ICP

DEPOSITION:
    CVC-601 DC Sputter System
    CHA Metal Evaporator
    Dielectric Evaporator
    Indium Evaporator
    Angstrom Evaporator
    Denton RF/DC Sputter System

THERMAL OXIDATION & ANNEAL:
    Black Max furnaces in
        Classroom Lab
    MRL furnaces
    Tystar furnaces

BONDING:
    EV Wafer Bonder and Aligner
         PLASMA ETCH:
    PlasmaTherm 770 ECR (III-V)
    PlasmaTherm 770 ICP (metals)
    Trion Minilock
    STS ICP (deep Si)
    XeF2 Isotropic Si Ecther

THERMAL DEPOSITION:
    LPCVD Polysilicon
    LPCVD Nitride
    LTO

LITHOGRAPHY:
    Nikon Stepper

Systems in the "Basic Equipment" category are made available under the Cleanroom Hourly Rate, and incur no additional equipment charges.




Copyright 2011 The Board of Regents of the University of Wisconsin System
Date last modified: 14-July-2014
Date created: 21-Jun-2007
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